Message from the Editor-in-Chief
Dear Members of the IEEE Transportation Electrification Community,
It is my pleasure to join the Community’s eNewsletter team as the new Editor-in-Chief and to join efforts with several Associate Editors and Authors to bring you selected articles and announcements on transportation electrification. This is a time when transportation electrification is of global interest due to increasing climate change concerns which transportation electrification will help reduce. Along with exciting achievements and innovations in energy conversion, energy efficiency, energy storage, control, communication, and instrumentation in electrified transportation, many challenges remain to be addressed by researchers, innovators, and engineers, especially those in the IEEE Transportation Electrification Community (TEC). Challenges such as cyber-security in vehicular applications, safety, reliability, packaging, and many others should be addressed.
The new eNewsletter brings you a theme every quarter starting with the second quarter (June 30th issue). Themes will cover challenges and their related discussions, and you are all invited to contribute and share your research, discussions, and innovations with other IEEE TEC members. The second quarter call for articles has been issued and is included in this first quarter eNewsletter. The theme for the second quarter is “Cybersecurity in Transportation Electrification Applications,” and articles are due on April 30, 2016. The third quarter theme is planned to be on “Aerospace Transportation Electrification,” and its articles will be due by July 29th, 2016 with a formal call for articles to be released by the end of May 2016.
I am looking forward to your contributions and feedback. If you have any questions, please feel free to contact me at the email address shown below.
Ali M. Bazzi
About the Newsletter
TEC Call for Articles 2023 - Advances in Charging Systems
The TEC eNewsletter is now being indexed by Google Scholar and peer-reviewed articles are being submitted to IEEE Xplore.